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llm-kg-bench-results_2023-07-03_13-53-48_FactExtract-gpt4-20x.json
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llm-kg-bench-results_2023-07-03_13-53-48_FactExtract-gpt4-20x.json
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[
{
"startTime": "2023-07-03T13:53:48.836710",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"printMat_precision": 1.0,
"printMat_recall": 0.0,
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"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 0.0,
"DimValues_recall": 0.0,
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"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
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"parsableTriples": "_:n43b7e0597f774ce5a76020ea3c0898afb1 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliMETER> .\n_:n43b7e0597f774ce5a76020ea3c0898afb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n43b7e0597f774ce5a76020ea3c0898afb1 .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n43b7e0597f774ce5a76020ea3c0898afb1 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n"
},
"duration": "0:00:34.173259",
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[
"prompt",
"2023-07-03T13:53:48.836721",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:54:23.009969",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix unit: <http://qudt.org/vocab/unit/> .\n@prefix schema: <http://schema.org/> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix sp: <https://data.semper-ki.org/properties/> .\n\nsk:Industry_F340\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer sk:3DGence ;\n sp:printMaterial sk:materials/ABS, sk:materials/PLA, sk:materials/PA, sk:materials/ASA, sk:materials/PP, sk:materials/TPU,\n sk:materials/PA-CF, sk:materials/PA-GF, sk:materials/PC, sk:materials/PC-ABS, sk:materials/PC-ESD, sk:materials/PC-CF,\n sk:materials/PEEK, sk:materials/PEKK ;\n sp:supportMaterial sk:materials/ESM-10, sk:materials/HIPS, sk:materials/BVOH, sk:materials/ABS ;\n schema:width [ a qudt:QuantityValue ; qudt:numericValue \"1200.0\"^^xsd:double ; qudt:unit unit:MilliMETER ],\n schema:depth [ a qudt:QuantityValue ; qudt:numericValue \"800.0\"^^xsd:double ; qudt:unit unit:MilliMETER ],\n schema:height [ a qudt:QuantityValue ; qudt:numericValue \"1100.0\"^^xsd:double ; qudt:unit unit:MilliMETER ] .\n\nsk:3DGence\n rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:54:23.299803",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"normDiffRatio": 0.42985302538652415,
"norm_precision": 0.5833333333333334,
"norm_recall": 0.2413793103448276,
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"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.46875
},
"info": {
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"parsableTriples": "_:n02b7a532b35d40d188e956e8c7c47cb9b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:n02b7a532b35d40d188e956e8c7c47cb9b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n02b7a532b35d40d188e956e8c7c47cb9b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n02b7a532b35d40d188e956e8c7c47cb9b2 <http://qudt.org/schema/qudt#numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n02b7a532b35d40d188e956e8c7c47cb9b2 .\n_:n02b7a532b35d40d188e956e8c7c47cb9b3 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n02b7a532b35d40d188e956e8c7c47cb9b1 .\n_:n02b7a532b35d40d188e956e8c7c47cb9b2 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n02b7a532b35d40d188e956e8c7c47cb9b1 <http://qudt.org/schema/qudt#numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n02b7a532b35d40d188e956e8c7c47cb9b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:n02b7a532b35d40d188e956e8c7c47cb9b3 <http://qudt.org/schema/qudt#numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n02b7a532b35d40d188e956e8c7c47cb9b1 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit#MilliM> .\n"
},
"duration": "0:00:31.303359",
"interactions": [
[
"prompt",
"2023-07-03T13:54:23.299808",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:54:54.603162",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix qudtu: <http://qudt.org/vocab/unit#> .\n@prefix skio: <https://data.semper-ki.org/resources/> .\n@prefix skip: <https://data.semper-ki.org/properties/> .\n\nskio:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer skio:3DGence ;\n skip:printMaterial skio:materials/ABS, skio:materials/PLA, skio:materials/PA, \n skio:materials/ASA, skio:materials/PP, skio:materials/TPU, skio:materials/PEEK, \n skio:materials/PEKK ;\n skip:supportMaterial skio:materials/ESM-10, skio:materials/HIPS, skio:materials/BVOH ;\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:unit qudtu:MilliM\n ];\n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:unit qudtu:MilliM\n ];\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:unit qudtu:MilliM\n ] .\n\nskio:3DGence rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:54:54.858231",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.39159826170931916,
"normDiffRatio": 0.4041174227983225,
"norm_precision": 0.5833333333333334,
"norm_recall": 0.2413793103448276,
"norm_f-measure": 0.34146341463414637,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 0.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.46875
},
"info": {
"parsableTriplesCount": 15,
"parsableTriples": "_:n1af70dcbbe094d24b43fba87a8f76397b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n1af70dcbbe094d24b43fba87a8f76397b2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n1af70dcbbe094d24b43fba87a8f76397b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n1af70dcbbe094d24b43fba87a8f76397b1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/width> _:n1af70dcbbe094d24b43fba87a8f76397b1 .\n_:n1af70dcbbe094d24b43fba87a8f76397b1 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/depth> _:n1af70dcbbe094d24b43fba87a8f76397b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/height> _:n1af70dcbbe094d24b43fba87a8f76397b2 .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n1af70dcbbe094d24b43fba87a8f76397b2 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n1af70dcbbe094d24b43fba87a8f76397b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n1af70dcbbe094d24b43fba87a8f76397b3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n_:n1af70dcbbe094d24b43fba87a8f76397b3 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n"
},
"duration": "0:00:37.133964",
"interactions": [
[
"prompt",
"2023-07-03T13:54:54.858237",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:55:31.992195",
"```ttl\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <https://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix skires: <https://data.semper-ki.org/resources/> .\n@prefix skiprop: <https://data.semper-ki.org/properties/> .\n\nskires:Industry_F340\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer skires:3DGence ;\n skiprop:printMaterial skires:materials/ABS, \n skires:materials/PLA, \n skires:materials/PA, \n skires:materials/ASA, \n skires:materials/PP, \n skires:materials/TPU, \n skires:materials/PC, \n skires:materials/PC_ABS,\n skires:materials/PC_ESD, \n skires:materials/PC_CF, \n skires:materials/PEEK, \n skires:materials/PEKK ;\n skiprop:supportMaterial skires:materials/ESM-10, \n skires:materials/HIPS, \n skires:materials/BVOH ;\n schema:width [ a qudt:QuantityValue ; \n qudt:numericValue \"1200\"^^xsd:double ; \n qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:height [ a qudt:QuantityValue ; \n qudt:numericValue \"1100\"^^xsd:double ; \n qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:depth [ a qudt:QuantityValue ; \n qudt:numericValue \"800\"^^xsd:double ; \n qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] .\n\nskires:3DGence \n rdfs:label \"3DGence\" .\n```"
]
]
},
{
"startTime": "2023-07-03T13:55:32.332645",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3912667531344574,
"normDiffRatio": 0.9442350188483036,
"norm_precision": 0.8518518518518519,
"norm_recall": 0.7931034482758621,
"norm_f-measure": 0.8214285714285715,
"printMat_precision": 0.9166666666666666,
"printMat_recall": 0.8461538461538461,
"printMat_f-measure": 0.8799999999999999,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 0.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 1.0,
"DimUnit_f-measure": 1.0,
"parsableTripleRatio": 0.9375
},
"info": {
"parsableTriplesCount": 30,
"parsableTriples": "_:nd48fb9a36d004a32b4cc6bd276ddb3b0b3 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MilliM> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b1 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MilliM> .\n_:nd48fb9a36d004a32b4cc6bd276ddb3b0b2 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nd48fb9a36d004a32b4cc6bd276ddb3b0b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nd48fb9a36d004a32b4cc6bd276ddb3b0b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nd48fb9a36d004a32b4cc6bd276ddb3b0b1 .\n"
},
"duration": "0:00:51.987858",
"interactions": [
[
"prompt",
"2023-07-03T13:55:32.332650",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:56:24.320503",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix temaki: <https://purl.org/tema/> .\n@prefix skires: <https://data.semper-ki.org/resources/> .\n@prefix skiprop: <https://data.semper-ki.org/properties/> .\n@prefix qudtunit: <http://qudt.org/vocab/unit/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type temaki:051993 ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n skiprop:printMaterial <https://data.semper-ki.org/resources/materials/ABS>,\n <https://data.semper-ki.org/resources/materials/PLA>,\n <https://data.semper-ki.org/resources/materials/PA>,\n <https://data.semper-ki.org/resources/materials/ASA>,\n <https://data.semper-ki.org/resources/materials/PP>,\n <https://data.semper-ki.org/resources/materials/TPU>,\n <https://data.semper-ki.org/resources/materials/PC>,\n <https://data.semper-ki.org/resources/materials/PC-ABS>,\n <https://data.semper-ki.org/resources/materials/PC-ESD>,\n <https://data.semper-ki.org/resources/materials/PC-CF>,\n <https://data.semper-ki.org/resources/materials/PEEK>,\n <https://data.semper-ki.org/resources/materials/PEKK> ;\n skiprop:supportMaterial <https://data.semper-ki.org/resources/materials/ESM-10>,\n <https://data.semper-ki.org/resources/materials/HIPS>,\n <https://data.semper-ki.org/resources/materials/BVOH> ;\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue 800.0 ;\n qudt:hasUnit qudtunit:MilliM\n ] ;\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue 1200.0 ;\n qudt:hasUnit qudtunit:MilliM\n ] ;\n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue 1100.0 ;\n qudt:hasUnit qudtunit:MilliM\n ] .\n \n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:56:24.440003",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.32450331125827814,
"normDiffRatio": 0.4393505253104107,
"norm_precision": 0.6666666666666666,
"norm_recall": 0.27586206896551724,
"norm_f-measure": 0.3902439024390244,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 0.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 0.0,
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"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n12ab8432239343d496c6224648306d90b1 .\n_:n12ab8432239343d496c6224648306d90b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n12ab8432239343d496c6224648306d90b3 <http://qudt.org/schema/qudt/numericValue> \"1200\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n12ab8432239343d496c6224648306d90b3 .\n_:n12ab8432239343d496c6224648306d90b1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/mm> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n12ab8432239343d496c6224648306d90b2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/mm> .\n_:n12ab8432239343d496c6224648306d90b1 <http://qudt.org/schema/qudt/numericValue> \"1100\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n_:n12ab8432239343d496c6224648306d90b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n12ab8432239343d496c6224648306d90b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n12ab8432239343d496c6224648306d90b3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/mm> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n12ab8432239343d496c6224648306d90b2 <http://qudt.org/schema/qudt/numericValue> \"800\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n12ab8432239343d496c6224648306d90b2 .\n"
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"duration": "0:00:34.455329",
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"2023-07-03T13:56:24.440008",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:56:58.895332",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix uom: <http://qudt.org/vocab/unit/> .\n@prefix ki: <https://data.semper-ki.org/resources/> .\n@prefix kiProp: <https://data.semper-ki.org/properties/> .\n\nki:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer ki:3DGence ;\n kiProp:printMaterial ki:materials/ABS, ki:materials/PLA, ki:materials/PA, ki:materials/ASA, ki:materials/PP, ki:materials/TPU, ki:materials/PA-CF, ki:materials/PA-GF, ki:materials/PC, ki:materials/PC-ABS, ki:materials/PC-ESD, ki:materials/PC-CF, ki:materials/PEEK, ki:materials/PEKK ;\n kiProp:supportMaterial ki:materials/ESM-10, ki:materials/HIPS, ki:materials/BVOH, ki:materials/ABS ;\n schema:height [ a qudt:QuantityValue ; qudt:numericValue 1100 ; qudt:hasUnit uom:mm ] ;\n schema:width [ a qudt:QuantityValue ; qudt:numericValue 800 ; qudt:hasUnit uom:mm ] ;\n schema:depth [ a qudt:QuantityValue ; qudt:numericValue 1200 ; qudt:hasUnit uom:mm ] .\n\nki:3DGence rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:56:58.989157",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"printMat_recall": 1.0,
"printMat_f-measure": 0.962962962962963,
"supportMat_precision": 1.0,
"supportMat_recall": 1.0,
"supportMat_f-measure": 1.0,
"DimValues_precision": 0.3333333333333333,
"DimValues_recall": 1.0,
"DimValues_f-measure": 0.5,
"DimUnit_precision": 0.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.875
},
"info": {
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"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<http://qudt.org/schema/qudt/QuantityValue> <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<http://qudt.org/schema/qudt/QuantityValue> <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> <http://qudt.org/schema/qudt/QuantityValue> .\n<http://qudt.org/schema/qudt/QuantityValue> <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<http://qudt.org/schema/qudt/QuantityValue> <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MILLI_M> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n"
},
"duration": "0:00:30.551823",
"interactions": [
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"prompt",
"2023-07-03T13:56:58.989162",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:57:29.540980",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix unit: <http://qudt.org/vocab/unit/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix data: <https://data.semper-ki.org/resources/> .\n@prefix props: <https://data.semper-ki.org/properties/> .\n@prefix material: <https://data.semper-ki.org/resources/materials/> .\n\ndata:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer data:3DGence ;\n props:printMaterial material:ABS, material:PLA, material:PA, material:ASA, material:PP, material:TPU, material:ABS, material:ASA, material:PA-CF, material:PA-GF, material:PA, material:PP, material:PC, material:PC-ABS, material:PC-ESD, material:PC-CF, material:PEEK, material:PEKK ;\n props:supportMaterial material:ESM-10, material:HIPS, material:BVOH, material:ESM-10, material:HIPS, material:ABS, material:ESM-10, material:ESM-10 ;\n schema:height qudt:QuantityValue ;\n schema:width qudt:QuantityValue ;\n schema:depth qudt:QuantityValue .\n\nqudt:QuantityValue\n qudt:numericValue \"1200.0\"^^xsd:double ;\n qudt:hasUnit unit:MILLI_M .\n\nqudt:QuantityValue\n qudt:numericValue \"800.0\"^^xsd:double ;\n qudt:hasUnit unit:MILLI_M .\n\nqudt:QuantityValue\n qudt:numericValue \"1100.0\"^^xsd:double ;\n qudt:hasUnit unit:MILLI_M .\n\ndata:3DGence rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:57:29.691487",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
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"parsableTripleRatio": 0.46875
},
"info": {
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"parsableTriples": "_:n3f94783cc88f434aa152d47a27f3970db3 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n_:n3f94783cc88f434aa152d47a27f3970db2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n3f94783cc88f434aa152d47a27f3970db2 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n3f94783cc88f434aa152d47a27f3970db1 .\n_:n3f94783cc88f434aa152d47a27f3970db1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n3f94783cc88f434aa152d47a27f3970db2 .\n_:n3f94783cc88f434aa152d47a27f3970db2 <http://qudt.org/schema/qudt/numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n3f94783cc88f434aa152d47a27f3970db3 <http://qudt.org/schema/qudt/numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n3f94783cc88f434aa152d47a27f3970db3 .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n3f94783cc88f434aa152d47a27f3970db1 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n_:n3f94783cc88f434aa152d47a27f3970db3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n3f94783cc88f434aa152d47a27f3970db1 <http://qudt.org/schema/qudt/numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n"
},
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"2023-07-03T13:57:29.691493",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:58:10.030376",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix qudtUnit: <http://qudt.org/vocab/unit/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix skp: <https://data.semper-ki.org/properties/> .\n@prefix tema: <https://purl.org/tema/> .\n\nsk:Industry_F340 rdf:type tema:051993 ;\n schema:manufacturer sk:3DGence \n ;\n skp:printMaterial sk:materials/ABS, sk:materials/PLA, sk:materials/PA, sk:materials/ASA, sk:materials/PP, sk:materials/TPU, sk:materials/PC, sk:materials/PC-ABS, sk:materials/PC-ESD, sk:materials/PC-CF, sk:materials/PEEK, sk:materials/PEKK\n ;\n skp:supportMaterial sk:materials/ESM-10, sk:materials/HIPS, sk:materials/BVOH, sk:materials/ABS\n ;\n schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:unit qudtUnit:MilliM\n ] ;\n schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:unit qudtUnit:MilliM\n ] ;\n schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:unit qudtUnit:MilliM\n ] .\n\nsk:3DGence rdfs:label \"3DGence\" .\n"
]
]
},
{
"startTime": "2023-07-03T13:58:10.153675",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
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"prompt",
"2023-07-03T13:58:10.153679",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:58:49.411567",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix sk: <https://data.semper-ki.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n\nsk:resources/Industry_F340\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer sk:resources/3DGence ;\n sk:properties/printMaterial sk:resources/materials/ABS, sk:resources/materials/PLA, sk:resources/materials/PA, sk:resources/materials/ASA, sk:resources/materials/PP, sk:resources/materials/TPU, sk:resources/materials/PA-CF, sk:resources/materials/PA-GF, sk:resources/materials/PC, sk:resources/materials/PC-ABS, sk:resources/materials/PC-ESD, sk:resources/materials/PC-CF, sk:resources/materials/PEEK, sk:resources/materials/PEKK ;\n sk:properties/supportMaterial sk:resources/materials/ESM-10, sk:resources/materials/HIPS, sk:resources/materials/BVOH, sk:resources/materials/ABS ;\n schema:width [ qudt:numericValue \"1200.0\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:height [ qudt:numericValue \"1100.0\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:depth [ qudt:numericValue \"800.0\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> ] .\n\nsk:resources/3DGence\n rdfs:label \"3DGence\" .\n"
]
]
},
{
"startTime": "2023-07-03T13:58:49.583418",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
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"DimValues_recall": 0.0,
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"info": {
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"parsableTriples": "_:n208edddc343d428e804b0a13c98a279ab2 <http://qudt.org/schema/qudt#numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n_:n208edddc343d428e804b0a13c98a279ab2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n208edddc343d428e804b0a13c98a279ab1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n_:n208edddc343d428e804b0a13c98a279ab1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n208edddc343d428e804b0a13c98a279ab2 .\n_:n208edddc343d428e804b0a13c98a279ab1 <http://qudt.org/schema/qudt#numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n_:n208edddc343d428e804b0a13c98a279ab3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n208edddc343d428e804b0a13c98a279ab1 .\n_:n208edddc343d428e804b0a13c98a279ab2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n208edddc343d428e804b0a13c98a279ab3 <http://qudt.org/schema/qudt#numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n208edddc343d428e804b0a13c98a279ab3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n208edddc343d428e804b0a13c98a279ab3 .\n"
},
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"prompt",
"2023-07-03T13:58:49.583424",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:59:22.692992",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix qudt-unit: <http://qudt.org/vocab/unit#> .\n@prefix tema: <https://purl.org/tema/> .\n@prefix semperki: <https://data.semper-ki.org/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> \n rdf:type tema:051993 ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n semperki:properties/printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU, materials:PA-CF, materials:PA-GF, materials:PC, materials:PC-ABS, materials:PC-ESD, materials:PC-CF, materials:PEEK, materials:PEKK ;\n semperki:properties/supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:depth [ a qudt:QuantityValue ; qudt:numericValue 1200.0 ; qudt:hasUnit qudt-unit:MilliM ] ;\n schema:height [ a qudt:QuantityValue ; qudt:numericValue 800.0 ; qudt:hasUnit qudt-unit:MilliM ] ;\n schema:width [ a qudt:QuantityValue ; qudt:numericValue 1100.0 ; qudt:hasUnit qudt-unit:MilliM ] .\n\n<https://data.semper-ki.org/resources/3DGence> rdfs:label \"3DGence\" .\n"
]
]
},
{
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"parsableTriples": "_:na259e53b0ae14ac2af7163554fa1b02cb1 <http://schema.org/width> _:na259e53b0ae14ac2af7163554fa1b02cb4 .\n_:na259e53b0ae14ac2af7163554fa1b02cb5 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:na259e53b0ae14ac2af7163554fa1b02cb4 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:na259e53b0ae14ac2af7163554fa1b02cb1 <http://schema.org/height> _:na259e53b0ae14ac2af7163554fa1b02cb3 .\n_:na259e53b0ae14ac2af7163554fa1b02cb4 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:na259e53b0ae14ac2af7163554fa1b02cb5 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit#MilliM> .\n_:na259e53b0ae14ac2af7163554fa1b02cb3 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit#MilliM> .\n_:na259e53b0ae14ac2af7163554fa1b02cb4 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit#MilliM> .\n_:na259e53b0ae14ac2af7163554fa1b02cb2 <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:na259e53b0ae14ac2af7163554fa1b02cb3 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:na259e53b0ae14ac2af7163554fa1b02cb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:na259e53b0ae14ac2af7163554fa1b02cb1 <http://schema.org/depth> _:na259e53b0ae14ac2af7163554fa1b02cb5 .\n_:na259e53b0ae14ac2af7163554fa1b02cb5 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:na259e53b0ae14ac2af7163554fa1b02cb1 <http://schema.org/manufacturer> _:na259e53b0ae14ac2af7163554fa1b02cb2 .\n_:na259e53b0ae14ac2af7163554fa1b02cb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n"
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"2023-07-03T13:59:22.798178",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
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"2023-07-03T14:00:00.042360",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix skio: <https://data.semper-ki.org/resources/> .\n@prefix skprop: <https://data.semper-ki.org/properties/> .\n@prefix tema: <https://purl.org/tema/> .\n\n_:Industry_F340 rdf:type tema:051993 ;\n schema:manufacturer _:3DGence ;\n skprop:printMaterial skio:materials/ABS, skio:materials/PLA, skio:materials/PA, skio:materials/ASA, skio:materials/PP, skio:materials/TPU, skio:materials/PC, skio:materials/PC_ABS, skio:materials/PC_ESD, skio:materials/PC_CF, skio:materials/PEEK, skio:materials/PEKK ;\n skprop:supportMaterial skio:materials/ESM_10, skio:materials/HIPS, skio:materials/BVOH ;\n schema:height [ a qudt:QuantityValue ; qudt:numericValue \"1100\"^^xsd:double ; qudt:unit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:width [ a qudt:QuantityValue ; qudt:numericValue \"1200\"^^xsd:double ; qudt:unit <http://qudt.org/vocab/unit#MilliM> ] ;\n schema:depth [ a qudt:QuantityValue ; qudt:numericValue \"800\"^^xsd:double ; qudt:unit <http://qudt.org/vocab/unit#MilliM> ] .\n\n_:3DGence rdfs:label \"3DGence\" ."
]
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},
{
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"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
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"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
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"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.46875
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"info": {
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"parsableTriples": "_:n50fe73ea74fd431e8a5ffc8ca76bf7edb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n50fe73ea74fd431e8a5ffc8ca76bf7edb2 .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb1 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n50fe73ea74fd431e8a5ffc8ca76bf7edb1 .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb3 <http://qudt.org/schema/qudt#numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb3 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb1 <http://qudt.org/schema/qudt#numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb2 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n50fe73ea74fd431e8a5ffc8ca76bf7edb3 .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:n50fe73ea74fd431e8a5ffc8ca76bf7edb2 <http://qudt.org/schema/qudt#numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n"
},
"duration": "0:00:43.260503",
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"2023-07-03T14:00:00.141436",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T14:00:43.401934",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix unit: <http://qudt.org/vocab/unit/> .\n@prefix schema: <http://schema.org/> .\n@prefix semper-ki: <https://data.semper-ki.org/resources/> .\n@prefix semper-ki-prop: <https://data.semper-ki.org/properties/> .\n\nsemper-ki:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer semper-ki:3DGence ;\n semper-ki-prop:printMaterial semper-ki:materials/ABS, semper-ki:materials/PLA, semper-ki:materials/PA, semper-ki:materials/ASA, semper-ki:materials/PP, semper-ki:materials/TPU, semper-ki:materials/PA-CF, semper-ki:materials/PA-GF, semper-ki:materials/PC, semper-ki:materials/PC-ABS, semper-ki:materials/PC-ESD, semper-ki:materials/PC-CF, semper-ki:materials/PEEK, semper-ki:materials/PEKK ;\n semper-ki-prop:supportMaterial semper-ki:materials/ESM-10, semper-ki:materials/HIPS, semper-ki:materials/BVOH, semper-ki:materials/ABS ;\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] ;\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] ;\n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] .\n\nsemper-ki:3DGence rdfs:label \"3DGence\" ."
]
]
},
{
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"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
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"info": {
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"parsableTriples": "_:nbb148e369f7348abbfd5127c6096f19bb1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nbb148e369f7348abbfd5127c6096f19bb1 .\n_:nbb148e369f7348abbfd5127c6096f19bb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:nbb148e369f7348abbfd5127c6096f19bb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:nbb148e369f7348abbfd5127c6096f19bb2 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:nbb148e369f7348abbfd5127c6096f19bb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:nbb148e369f7348abbfd5127c6096f19bb2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n_:nbb148e369f7348abbfd5127c6096f19bb3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n_:nbb148e369f7348abbfd5127c6096f19bb1 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:nbb148e369f7348abbfd5127c6096f19bb3 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nbb148e369f7348abbfd5127c6096f19bb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nbb148e369f7348abbfd5127c6096f19bb2 .\n"
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"2023-07-03T14:00:43.503554",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T14:01:28.048166",
"```\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix skp: <https://data.semper-ki.org/properties/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> \n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n skp:printMaterial sk:materials/ABS, sk:materials/PLA, sk:materials/PA, sk:materials/ASA, sk:materials/PP, sk:materials/TPU, sk:materials/PC, sk:materials/PC-ABS, sk:materials/PC-ESD, sk:materials/PC-CF, sk:materials/PEEK, sk:materials/PEKK;\n skp:supportMaterial sk:materials/ESM-10, sk:materials/HIPS, sk:materials/BVOH;\n schema:depth [\n a qudt:QuantityValue ; \n qudt:numericValue \"800\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> \n ] ;\n schema:height [\n a qudt:QuantityValue ; \n qudt:numericValue \"1100\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> \n ] ;\n schema:width [\n a qudt:QuantityValue ; \n qudt:numericValue \"1200\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#MilliM> \n ] .\n\n<https://data.semper-ki.org/resources/3DGence>\n rdfs:label \"3DGence\" .\n```"
]
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},
{
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"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
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"prompt",
"2023-07-03T14:01:28.171582",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T14:02:03.490024",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix stk: <https://data.semper-ki.org/resources/> .\n@prefix stp: <https://data.semper-ki.org/properties/> .\n@prefix unit: <http://qudt.org/vocab/unit/> .\n\nstk:Industry_F340 a <https://purl.org/tema/051993> ;\n schema:manufacturer stk:3DGence ;\n stp:printMaterial stk:materials/ABS,\n stk:materials/PLA,\n stk:materials/PA,\n stk:materials/ASA,\n stk:materials/PP,\n stk:materials/TPU,\n stk:materials/PA-CF,\n stk:materials/PA-GF,\n stk:materials/PC,\n stk:materials/PC-ABS,\n stk:materials/PC-ESD,\n stk:materials/PC-CF,\n stk:materials/PEEK,\n stk:materials/PEKK ;\n stp:supportMaterial stk:materials/ESM-10,\n stk:materials/HIPS,\n stk:materials/BVOH ;\n schema:width [ a qudt:QuantityValue ;\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:unit unit:Millimeter],\n schema:height [ a qudt:QuantityValue ;\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:unit unit:Millimeter],\n schema:depth [ a qudt:QuantityValue ;\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:unit unit:Millimeter].\n\nstk:3DGence rdfs:label \"3DGence\" ."
]
]
},
{
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"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
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"DimValues_recall": 0.0,
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"parsableTriples": "_:ndbf991d2279c411dac1fa0c4821c608ab3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:ndbf991d2279c411dac1fa0c4821c608ab1 .\n_:ndbf991d2279c411dac1fa0c4821c608ab1 <http://qudt.org/schema/qudt#numericValue> \"1.1\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:ndbf991d2279c411dac1fa0c4821c608ab2 .\n_:ndbf991d2279c411dac1fa0c4821c608ab1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:ndbf991d2279c411dac1fa0c4821c608ab2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:ndbf991d2279c411dac1fa0c4821c608ab2 <http://qudt.org/schema/qudt#numericValue> \"0.8\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n_:ndbf991d2279c411dac1fa0c4821c608ab3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:ndbf991d2279c411dac1fa0c4821c608ab3 .\n_:ndbf991d2279c411dac1fa0c4821c608ab1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:ndbf991d2279c411dac1fa0c4821c608ab2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Meter> .\n_:ndbf991d2279c411dac1fa0c4821c608ab3 <http://qudt.org/schema/qudt#numericValue> \"1.2\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n"
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"2023-07-03T14:02:03.960359",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T14:02:47.375247",
"```turtle\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix unit: <http://qudt.org/vocab/unit#> .\n@prefix tema: <https://purl.org/tema/> .\n@prefix soki: <https://data.semper-ki.org/resources/> .\n@prefix sokip: <https://data.semper-ki.org/properties/> .\n\nsoki:Industry_F340 a tema:051993 ;\n schema:manufacturer soki:3DGence ;\n sokip:printMaterial soki:materials/ABS, soki:materials/PLA, soki:materials/PA, soki:materials/ASA, soki:materials/PP, soki:materials/TPU, soki:materials/PA_CF, soki:materials/PA_GF, soki:materials/PC, soki:materials/PC_ABS, soki:materials/PC_ESD, soki:materials/PC_CF, soki:materials/PEEK, soki:materials/PEKK ;\n sokip:supportMaterial soki:materials/ESM_10, soki:materials/HIPS, soki:materials/BVOH, soki:materials/ABS ;\n schema:height [a qudt:QuantityValue ; qudt:numericValue 1.1 ; qudt:hasUnit unit:Meter] ;\n schema:width [a qudt:QuantityValue ; qudt:numericValue 0.8 ; qudt:hasUnit unit:Meter] ;\n schema:depth [a qudt:QuantityValue ; qudt:numericValue 1.2 ; qudt:hasUnit unit:Meter] .\n\nsoki:3DGence rdfs:label \"3DGence\" .\n```"
]
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"parsableTriples": "_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb1 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb3 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb2 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb1 .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb3 .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb2 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb1 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb3 <http://qudt.org/schema/qudt/unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n6eb7b3f1e4fb44d69ae4c3f2aeea31abb2 .\n"
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"2023-07-03T14:02:47.489836",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
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"response",
"2023-07-03T14:03:23.830782",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix unit: <http://qudt.org/vocab/unit/> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix skp: <https://data.semper-ki.org/properties/> .\n\nsk:Industry_F340 \n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer sk:3DGence ;\n skp:printMaterial sk:materials/ABS , sk:materials/PLA , sk:materials/PA , sk:materials/ASA , sk:materials/PP , sk:materials/TPU , sk:materials/PA-GF , sk:materials/PA-CF , sk:materials/PC , sk:materials/PC-CF , sk:materials/PC-ABS , sk:materials/PC-ESD , sk:materials/PEEK , sk:materials/PEKK ;\n skp:supportMaterial sk:materials/ESM-10 , sk:materials/HIPS , sk:materials/BVOH ;\n\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue \"1200.0\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] ;\n \n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue \"1100.0\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] ;\n\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue \"800.0\"^^xsd:double ;\n qudt:unit unit:MilliM\n ] .\n\nsk:3DGence\n rdfs:label \"3DGence\" ."
]
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{
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"modelId": "GPT--gpt-4--gpt-4-0613",
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"2023-07-03T14:03:23.926883",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
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"response",
"2023-07-03T14:04:22.141186",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix qudt-unit: <http://qudt.org/vocab/unit/> .\n@prefix sk: <https://data.semper-ki.org/> .\n\nsk:resources/Industry_F340 a <https://purl.org/tema/051993> ;\n schema:manufacturer sk:resources/3DGence ;\n schema:depth sk:resources/Industry_F340/depth ;\n schema:height sk:resources/Industry_F340/height ;\n schema:width sk:resources/Industry_F340/width ;\n sk:properties/printMaterial sk:resources/materials/ABS,\n sk:resources/materials/PLA,\n sk:resources/materials/PA,\n sk:resources/materials/ASA,\n sk:resources/materials/PP,\n sk:resources/materials/TPU,\n sk:resources/materials/PC,\n sk:resources/materials/PC-ABS,\n sk:resources/materials/PC-ESD,\n sk:resources/materials/PC-CF,\n sk:resources/materials/PEEK,\n sk:resources/materials/PEKK;\n sk:properties/supportMaterial sk:resources/materials/ESM-10,\n sk:resources/materials/HIPS,\n sk:resources/materials/BVOH,\n sk:resources/materials/ABS.\n\nsk:resources/3DGence rdfs:label \"3DGence\".\n\nsk:resources/Industry_F340/depth a qudt:QuantityValue;\n qudt:numericValue \"800\"^^xsd:double;\n qudt:hasUnit qudt-unit:MilliM.\n \nsk:resources/Industry_F340/height a qudt:QuantityValue;\n qudt:numericValue \"1100\"^^xsd:double;\n qudt:hasUnit qudt-unit:MilliM.\n\nsk:resources/Industry_F340/width a qudt:QuantityValue;\n qudt:numericValue \"1200\"^^xsd:double;\n qudt:hasUnit qudt-unit:MilliM.\n\nsk:resources/materials/ABS rdfs:label \"ABS\".\nsk:resources/materials/PLA rdfs:label \"PLA\".\nsk:resources/materials/PA rdfs:label \"PA\".\nsk:resources/materials/ASA rdfs:label \"ASA\".\nsk:resources/materials/PP rdfs:label \"PP\".\nsk:resources/materials/TPU rdfs:label \"TPU\".\nsk:resources/materials/PC rdfs:label \"PC\".\nsk:resources/materials/PC-ABS rdfs:label \"PC-ABS\".\nsk:resources/materials/PC-ESD rdfs:label \"PC-ESD\".\nsk:resources/materials/PC-CF rdfs:label \"PC-CF\".\nsk:resources/materials/PEEK rdfs:label \"PEEK\".\nsk:resources/materials/PEKK rdfs:label \"PEKK\".\nsk:resources/materials/ESM-10 rdfs:label \"ESM-10\".\nsk:resources/materials/HIPS rdfs:label \"HIPS\".\nsk:resources/materials/BVOH rdfs:label \"BVOH\".\nsk:resources/materials/ABS rdfs:label \"ABS\"."
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{
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"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:n2d80fb5d00df4a188e40872d422e184cb3 <http://qudt.org/1.1/schema/qudt#numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n2d80fb5d00df4a188e40872d422e184cb2 <http://qudt.org/1.1/schema/qudt#numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n2d80fb5d00df4a188e40872d422e184cb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n2d80fb5d00df4a188e40872d422e184cb2 .\n_:n2d80fb5d00df4a188e40872d422e184cb1 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n_:n2d80fb5d00df4a188e40872d422e184cb3 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n2d80fb5d00df4a188e40872d422e184cb1 .\n_:n2d80fb5d00df4a188e40872d422e184cb1 <http://qudt.org/1.1/schema/qudt#numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n2d80fb5d00df4a188e40872d422e184cb2 <http://qudt.org/1.1/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliM> .\n"
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"2023-07-03T14:04:22.738817",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
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"2023-07-03T14:04:58.802415",
"```turtle\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix qudt: <http://qudt.org/1.1/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix units: <http://qudt.org/vocab/unit#> .\n@prefix pr: <https://data.semper-ki.org/properties/> .\n\nsk:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n\nschema:manufacturer sk:3DGence ;\nrdfs:label \"3DGence\" ;\n\npr:printMaterial sk:materials/ABS, sk:materials/PLA, sk:materials/PA, sk:materials/ASA, sk:materials/PP, sk:materials/TPU, \nsk:materials/PA-CF, sk:materials/PA-GF, sk:materials/PC, sk:materials/PC-ABS, sk:materials/PC-ESD, sk:materials/PC-CF, \nsk:materials/PEEK, sk:materials/PEKK ;\n\npr:supportMaterial sk:materials/ESM-10, sk:materials/HIPS, sk:materials/BVOH, sk:materials/ABS ;\n\nschema:width [ qudt:numericValue \"1200.0\"^^xsd:double ; qudt:hasUnit units:MilliM ] ;\nschema:depth [ qudt:numericValue \"800.0\"^^xsd:double ; qudt:hasUnit units:MilliM ] ;\nschema:height [ qudt:numericValue \"1100.0\"^^xsd:double ; qudt:hasUnit units:MilliM ] .\n\n```\nThis is the final result. I've converted the given 3D printer specification into RDF turtle format. For each specification, I've created a triple that links the given printer to its corresponding specification. All prefixes used in this script are declared at the beginning. The printer (Industry F340) and manufacturer (3DGence) are both assigned unique resource identifiers. For print and support material, material resources have been created, and for dimensions, quantities have been created with appropriate units. The script is validated and follows the best practices of Linked Data."
]
]
},
{
"startTime": "2023-07-03T14:04:59.036156",
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"taskInfo": {
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"info": {
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"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb3 <http://qudt.org/schema/qudt/numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb2 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MM> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb1 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nfcc0b53f63f34f04a3a5b271cc0f544bb1 .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt/QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb3 <http://qudt.org/schema/qudt/hasUnit> <http://qudt.org/vocab/unit/MM> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb2 <http://qudt.org/schema/qudt/numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nfcc0b53f63f34f04a3a5b271cc0f544bb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nfcc0b53f63f34f04a3a5b271cc0f544bb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:nfcc0b53f63f34f04a3a5b271cc0f544bb1 <http://qudt.org/schema/qudt/numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n"
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"2023-07-03T14:04:59.036162",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
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"response",
"2023-07-03T14:05:47.487533",
"```turtle\n@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix semper-ki: <https://data.semper-ki.org/resources/> .\n@prefix semper-ki-prop: <https://data.semper-ki.org/properties/> .\n@prefix tema: <https://purl.org/tema/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nsemper-ki:Industry_F340 rdf:type tema:051993 ;\n schema:manufacturer semper-ki:3DGence ;\n semper-ki-prop:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU, materials:PA-CF, materials:PA-GF, materials:PC, materials:PC-ABS, materials:PC-ESD, materials:PC-CF, materials:PEEK, materials:PEKK ;\n semper-ki-prop:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH, materials:ABS ;\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM>\n ] ;\n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM>\n ] ;\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM>\n ] .\n\nsemper-ki:3DGence rdfs:label \"3DGence\" .\n```\nNote: I've ignored xmlns:<http://www.w3.org/2001/XMLSchema#> double, because this is not actually a valid RDF property. It's a datatype and should be used as follows: \"800\"^^xsd:double.\n\n\n"
]
]
},
{
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"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
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"info": {
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"duration": "0:00:34.946065",
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"2023-07-03T14:05:47.635027",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
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[
"response",
"2023-07-03T14:06:22.581086",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix sk: <https://data.semper-ki.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix units: <http://qudt.org/vocab/unit/> .\n\nsk:resources/Industry_F340 rdf:type <https://purl.org/tema/051993> ;\nschema:manufacturer sk:resources/3DGence ;\nsk:properties/printMaterial sk:resources/materials/ABS, sk:resources/materials/PLA, sk:resources/materials/PA, sk:resources/materials/ASA, sk:resources/materials/PP, sk:resources/materials/TPU, sk:resources/materials/PC, sk:resources/materials/PC-ABS, sk:resources/materials/PC-ESD, sk:resources/materials/PC-CF, sk:resources/materials/PEEK, sk:resources/materials/PEKK ;\nsk:properties/supportMaterial sk:resources/materials/ESM-10, sk:resources/materials/HIPS, sk:resources/materials/BVOH, sk:resources/materials/ABS ;\nschema:width [ a qudt:QuantityValue ; qudt:numericValue \"800.0\"^^xsd:double ; qudt:unit units:MilliM ] ;\nschema:length [ a qudt:QuantityValue ; qudt:numericValue \"1200.0\"^^xsd:double ; qudt:unit units:MilliM ] ;\nschema:height [ a qudt:QuantityValue ; qudt:numericValue \"1100.0\"^^xsd:double ; qudt:unit units:MilliM ] .\n\nsk:resources/3DGence rdfs:label \"3DGence\" ."
]
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},
{
"startTime": "2023-07-03T14:06:22.749374",
"modelId": "GPT--gpt-4--gpt-4-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
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"scores": {
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"parsableTriples": "_:na4ddde5f867f40c3bc82e885f14d04c7b3 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b3 <http://qudt.org/schema/qudt#numericValue> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b2 <http://qudt.org/schema/qudt#numericValue> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b1 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b2 <http://qudt.org/schema/qudt#unit> <http://qudt.org/vocab/unit/MilliM> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:na4ddde5f867f40c3bc82e885f14d04c7b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:na4ddde5f867f40c3bc82e885f14d04c7b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:na4ddde5f867f40c3bc82e885f14d04c7b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n_:na4ddde5f867f40c3bc82e885f14d04c7b1 <http://qudt.org/schema/qudt#numericValue> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#decimal> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n"
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"prompt",
"2023-07-03T14:06:22.749379",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T14:06:52.310364",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix units: <http://qudt.org/vocab/unit/> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix pm: <https://data.semper-ki.org/properties/> .\n@prefix material: <https://data.semper-ki.org/resources/materials/> .\n\nsk:Industry_F340 rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer sk:3DGence ;\n pm:printMaterial material:ABS, material:PLA, material:PA, material:ASA, material:PP, material:TPU, material:PA-CF, material:PA-GF, material:PC, material:PC-ABS, material:PC-ESD, material:PC-CF, material:PEEK, material:PEKK ;\n pm:supportMaterial material:ESM-10, material:HIPS, material:BVOH ;\n schema:height [ a qudt:QuantityValue ; qudt:numericValue 1100.0 ; qudt:unit units:MilliM ] ;\n schema:width [ a qudt:QuantityValue ; qudt:numericValue 800.0 ; qudt:unit units:MilliM ] ;\n schema:depth [ a qudt:QuantityValue ; qudt:numericValue 1200.0 ; qudt:unit units:MilliM ] .\n\nsk:3DGence rdfs:label \"3DGence\" ."
]
]
}
]